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ELECTRONICS |
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Printed Circuit Boards |
 The
following are examples of ways we can help you reclaim |
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Lost inventory / labor dollars in your Assembly and Engineering |
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departments. |
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Repair of Defective Electroplating |
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Repairs
can be made to bare boards or to assembled boards, |
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without the need of rewiring or disassembly of components. |
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| Gold Contacts |
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Before
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After
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Repair of Damaged Contact (Fingers) Due to Peeling,
Lifting, or Accidental Coverage By Solder |
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Missing
contacts can be replaced. Damaged contacts can be |
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repaired and replated with gold,
nickel, rhodium, solder, tin, etc. |
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Repair of Lifted, Damaged, or Missing Pads and
Traces |
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These
can be restored to original condition without the need to |
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disassemble the components from loaded boards. |
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Adding New Holes or Plating Void Holes |
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Due
to engineering changes or plating defects either can be |
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done with a minimum of component removal. |
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Adding New Circuitry or Rerouting Traces on Existing
Circuit Boards |
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This
is valuable for both prototype work and to correct |
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production errors. |
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Repairing Breaks in Continuity |
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Small
breaks or scratches can be corrected by replating with |
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copper, followed by a final plate of gold, nickel, solder, |
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rhodium, tin, etc. |
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Slots |
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Repair
and relocate key slots. |
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Gold Plating Complicated Flexible Circuits |
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These
generally do not lend themselves to a bath plating |
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technique. |
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Adding Copper or Precious Metal Plating (Gold,
Rhodium, Silver, |
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Platinum), To Localized Areas For Special Circuit Requirements. |
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These
might include high current or voltage applications, |
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switching areas, lower contact resistance, etc. |
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Bondable Gold |
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Isolated
areas can be plated to improve solderability. |
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Multilayer |
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After
lamination, innerlayer opens and shorts can be repaired |
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on both bare and fully assembled boards. |
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Flaws
caused by delamination can be restored. |
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SMT
pads can be replaced. |
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Components
can be removed without damage to board. |
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